Global 3D TSV Market Is Expected To Grow At ~ 46.78% CAGR During The Forecast Period – ZMR Blog
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Global 3D TSV Market Is Expected To Grow At ~ 46.78% CAGR During The Forecast Period

Zion Market Research has published a new report titled “Global 3D TSV Market  by Product (Memory, MEMS, CMOS Image Sensors, Imaging and Optoelectronics, Advanced LED Packaging, and Others) and by End-Users (Consumer Electronics Sector, Information and Communication Technology Sector, Automotive Sector, Military, Aerospace and Defense, and Other Sectors): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2017 – 2024”. According to the report, global 3D TSV market was valued USD 2.49 billion in 2017 and is expected to reach around USD 36.50 billion by 2024, growing at a CAGR of 46.78% for the forecast period from 2018 to 2024.

3D TSV or through silicon via technology is one of the important technology used in the semiconductor industry. Through silicon via is an electrical connection passed vertically through a stacked silicon wafer or die. 3D TSV is the replacement for the 2D packaging technologies such as wire-bond and flip chips. Through Silicon Via (TSV) interconnects are used in a wide range of 2.5D and 3D packaging applications and architectures which requires very high performance and functionality at the lowest energy or performance metric. 3D TSV technology is significantly being used in improving the logic function and memory of the electronics, non-memory, and CMOS such as tablet PCs, smartphones, and televisions, among others.

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Increasing demand for high aspect ratio, minimum power consumption, and compact size chip architectures are driving the market of 3D TSV. Further, factors such as the robust outlook for the information & communication technologies, rapid increase in the cloud-based applications, and continuous development in the smart lighting sectors and DRAM are further increasing the adoption of 3D TSV technology for packaging solutions. Additionally, increasing demand for improved architecture in electronic products coupled with the growing trend of miniaturization of electronic devices is driving the global 3D TSV market. However, the thermal issues caused by higher levels of integration are restraining the growth of the 3D TSV market.

The market for 3D TSV is segmented into product, end-users, and region. On the basis of product, the global 3D TSV market is categorized into memory, MEMS, CMOS image sensors, imaging and optoelectronics, and advanced LED packaging, and others. Based on end-users, the global 3D TSV market is divided into the consumer electronics sector, information, and communication technology sector, automotive sector, military, aerospace and defense, and other sectors. All the segments are analyzed based on present and future trends and the market is projected from 2018 to 2024. Based on regions, the 3D TSV market is segmented into North America, Asia Pacific, Europe, Latin America, and the Middle East and Africa with its further categorization into the US, the UK, Germany, France, China, India, Japan, and Brazil.

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With the largest share, Asia Pacific was a leading regional market for 3D TSV in 2017 and is expected to maintain its dominance throughout the forecast period. The increasing usage of smartphones, tablets, and smartwatches has increased the growth of intensive consumer electronics, thereby creating a wide range of opportunities in the Asia Pacific region. North America and Europe are expected to witness a high growth rate owing to the increasing demand for improved and advanced electronic products having the smaller form factor, superior functionality, and reduced power consumption with a lower overall cost. Moreover, high adoption of 3D TSV in advance packaging technologies is predicted to contribute in the 3D TSV market growth in coming years. Latin America and the Middle East and Africa are projected to show noticeable growth in the 3D TSV market owing to the advancement in the semiconductor industries.

The prominent players of 3D TSV market include Intel Corporation, Samsung Electronics Co. Ltd., Toshiba Corp., Amkor Technology, Pure Storage Inc., Broadcom Ltd., Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, United Microelectronics Corp., STMicroelectronics NV, and Jiangsu Changing Electronics Technology Co. Ltd.

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The 3D TSV market is segmented as follows:

Global 3D TSV Market: Product Segment Analysis

  • Memory
  • MEMS
  • CMOS Image Sensors
  • Imaging and Optoelectronics
  • Advanced LED Packaging
  • Others

Global 3D TSV Market: End-User Segment Analysis

  • Consumer Electronics Sector
  • Information and Communication Technology Sector
  • Automotive Sector
  • Military, Aerospace and Defence
  • Other Sectors

Global 3D TSV Market: Regional Segment Analysis

  • North America
    • The U.S.
  • Europe
    • UK
    • France
    • Germany
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • The Middle East and Africa

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